Investigation of the Surface Adhesion Phenomena and Mechanism of Gold-Plated Contacts at Superlow Making/Breaking Speed

Authors

• Wanbin Ren, Harbin Institute of Technology
• Cheng Chang, Harbin Institute of Technology
• Yu Chen, Harbin Institute of Technology
• Sengjun Xue, Harbin Institute of Technology
• Ronald A. Coutu Jr., Air Force Institute of Technology

Document Type

Article

Publication Date

6-2015

Comments

Copyright © 2015, IEEE

The full article is available from IEEE via subscription or purchase, using the DOI link below.

DOI

10.1109/TCPMT.2015.2431494

Source Publication

IEEE Transactions on Components, Packaging and Manufacturing Technology (ISSN 2156-3950)

Recommended Citation

W. Ren, C. Chang, Y. Chen, S. Xue and R. A. Coutu, "Investigation of the Surface Adhesion Phenomena and Mechanism of Gold-Plated Contacts at Superlow Making/Breaking Speed," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 5, no. 6, pp. 771-778, June 2015, doi: 10.1109/TCPMT.2015.2431494.