Using Cross-Linked SU-8 to Flip-Chip Bond, Assemble, and Package MEMS Devices

Authors

Robert A. Lake, Air Force Institute of Technology
Ronald A. Coutu Jr., Air Force Institute of Technology

Document Type

Article

Publication Date

3-2015

Abstract

Excerpt: This paper investigates using an SU-8 photoresist as an adhesive material for flip-chip bonding, assembling, and packaging microelectromechanical systems devices. An important factor, when using SU-8 as an adhesive material is to control ultraviolet (UV) exposure during fabrication to maximize bond strength due to material cross linking.Abstract © IEEE

Comments

This article is accessible by subscription or purchase from the publisher, IEEE, using the DOI link below.

Author note: Robert Lake was an AFIT PhD candidate at the time of this article. (AFIT-ENG-DS-15-S-013, September 2015)

DOI

10.1109/TCPMT.2015.2395999

Source Publication

IEEE Transactions on Components, Packaging and Manufacturing Technology (ISSN 2156-3950)

Recommended Citation

R. A. Lake and R. A. Coutu, "Using Cross-Linked SU-8 to Flip-Chip Bond, Assemble, and Package MEMS Devices," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 5, no. 3, pp. 301-306, March 2015, doi: 10.1109/TCPMT.2015.2395999.