Effects of SU-8 Cross-linking on Flip-chip Bond Strength When Assembling and Packaging MEMS
Document Type
Article
Publication Date
1-8-2012
Abstract
New methods to assemble, integrate, and package micro devices are always needed in attempts to simplify and expedite fabrication methods to maximize throughput. Our paper focuses on assessing SU-8 as a viable material for packaging and flip chip bonding processes for MEMS and micro devices. In this paper, we vary the level of cross- linking through post exposure bake (PEB) times and assess rectangular ring test structures bonding strength following flip chip bonding through applied tensile loads. In addition, we performed initial assessments on the etching resiliency of varied cross-linking of SU-8. From initial results, the bonding strength is maximized following a 3-min PEB. Cross-linking appears to have minimal effects on SU-8's etch resiliency as all tested samples etched approximately 1.25 μm. From our initial results, SU-8 appears to be a viable and inexpensive material for wafer bonding, assembling and packaging MEMS devices.
Source Publication
Procedia Engineering
Recommended Citation
Glauvitz, N. E., Starman, L. A., Coutu, R. A., & Johnston, R. L. (2011). Effects of SU-8 cross-linking on flip-chip bond strength when assembling and packaging MEMS. Procedia Engineering, 25, 471–474. https://doi.org/10.1016/j.proeng.2011.12.117
Comments
This is an open access article under the terms of the Creative Commons Attribution‐NonCommercial‐NoDerivs License, which permits use and distribution in any medium, provided the original work is properly cited, the use is non‐commercial and no modifications or adaptations are made. CC BY-NC-ND 3.0
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