Abstract

A MEMS switch fabrication process and apparatus inclusive of a bulbous rounded surface movable contact assembly that is integral with the switch movable element and achieving of long contact wear life with low contact electrical resistance. The disclosed process is compatible with semiconductor integrated circuit fabrication materials and procedures and includes an unusual photoresist reflow step in which the bulbous contact shape is quickly defined in three dimensions from more easily achieved integrated circuit mask and etching-defined precursor shapes. A plurality of differing photoresist materials are used in the process. A large part of the contact and contact spring formation used in the invention is accomplished with low temperature processing including electroplating. Alternate processing steps achieving an alloy metal contact structure are included. Use of a subroutine of processing steps to achieve differing but related portions of the electrical contact structure is also included.

Document Type

Patent

Status

Issued

Issue Date

10-13-2009

Patent Number

US 7601554 B1 [7,601,554]

CPC Classification

B81C1/00103

Application number

11/047345

Assignees

Government of the United States, as represented by the Secretary of the Air Force, Washington, DC (US)

Filing Date

1-31-2005

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7601554.pdf (709 kB)
A0-page size US 7601554
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