Abstract
A novel fabrication process uses a combination of negative and positive photoresists with positive tone photomasks, resulting in masking layers suitable for bulk micromachining high-aspect ratio microelectromechanical systems (MEMS) devices. This technique allows the use of positive photomasks with negative resists, opening the door to an ability to create complementary mechanical structures without the fabrication delays and costs associated with having to obtain a negative photomask. In addition, whereas an SU-8 mask would normally be left in place after processing, a technique utilizing a positive photoresist as a release layer has been developed so that the SU-8 masking material can be removed post-etching.
Document Type
Patent
Status
Issued
Issue Date
11-5-2013
Patent Number
US 8574821 B1 [8,574,821]
CPC Classification
G03F7/2016
Application number
13/333169
Assignees
Government of the United States, as represented by the Secretary of the Air Force, Wright-Patterson AFB, OH (US)
Filing Date
12-21-2011
Recommended Citation
Ostrow, Scott A., and Ronald A. Coutu Jr.. MEMS Fabrication Process Base On SU-8 Masking Layers. United States Patent 8574821 (B1), issued 5 November 2013. https://scholar.afit.edu/patents/45
A0-size pages of US 8574821
Included in
Electro-Mechanical Systems Commons, Electronic Devices and Semiconductor Manufacturing Commons