Date of Award
Master of Science in Electrical Engineering
Department of Electrical and Computer Engineering
Tod V. Laurvick, PhD
The DoD requires a variety of COTS and number of custom microelectronics to provide important functionality to critical military systems. Photolithography and DRIE are two techniques commonly used in the development of deep anisotropic features for the fabrication and modification of microelectronics and MEMS. However, standard photolithography techniques are ineffective for unique substrate geometries and DRIE processes require a chemical passivation step only applicable to Si substrates. This work confirmed the capability of RIE using DWL to perform deep, highly selective, anisotropic etching on elevated, non-circular substrates.
Martin-Abood, Dylan T., "Characterization of Reactive Ion Etch Chemistries Using Direct Write Lithography" (2020). Theses and Dissertations. 3181.