Part of the VLSI and Circuits, Embedded and Hardware Systems Commons

Works by Phillip M. LaCasse in VLSI and Circuits, Embedded and Hardware Systems

2020

Predicting Contact-without-connection Defects on Printed Circuit Boards Employing Ball Grid Array Package Types: A Data Analytics Case Study in the Smart Manufacturing Environment, Phillip M. LaCasse, Wilkistar Otieno, Francisco P. Maturana
Faculty Publications

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