Abstract
A cooling structure for a heat source, where the cooling structure includes a beam having a first end and a second end and a length disposed therebetween. The beam is formed at least in part of a first material having a first thermal coefficient of expansion and a second material having a second thermal coefficient of expansion, where the first thermal coefficient of expansion is different from the second thermal coefficient of expansion. The first end of the beam is thermally connected to the heat source, such that heat generated by the heat source is conducted along the length of the beam to the second end of the beam. The heat conducted through the beam causes the beam to deflect as the first and second materials expand differently due to the difference in the first and second thermal coefficients of expansion.
Document Type
Patent
Status
Issued
Issue Date
10-10-2019
Patent Number
US 10427934 B1 [ 10,427,934 ]
CPC Classification
B81B7/0087; F03G7/06
Application number
15/662810
Assignees
Government of the United States, as represented by the Secretary of the Air Force, Wright-Patterson AFB, OH (US)
Filing Date
7-28-2017
Recommended Citation
Coutu, Jr., Ronald A., Robert S. LaFleur, John P. K. Walton, and LaVerne A. Starman. Thermal Management Using Microelectromechanical Systems Bimorph Cantilever Beams. United States Patent 10427934, issued 10 October 2019. https://scholar.afit.edu/patents/30